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 Laptop BGA Rework Station
Features
- Using three independent temperature control, more accurate;
- Upper and bottom heater using good material, can accurately regulate hot air flow
- and temperature, high temperature generated breeze, third with far infrared heating plate to preheat.
- The first, second and third-zone with 8 segment temperature up (down)+8 segment
- constant temperature control, can store 10 groups temperature curve;
- First zone and second start running temperature curve at the same time, third zone
- start running temperature rise and drop at the same time with first and second zone;
- The first-, second-zone with over temperature protection design;
- After remove and welding, using high-volume fan to cool the PCB board, prevent
- deformation of PCB board and ensure the effect of welding;
- The first temperature zone can be front and back, up and down adjustment and 360-degree rotation, convenient to operate;
- The second temperature can adjust according to different PCB board appearance and
- components, prevent collision with PCB lower plate components;
- The third zone can be moved right and left, suitable to repair large BGA, CBGA and
- BGA in partial side of PCB board;
- Equipped with a variety size of hot-air nozzle, or made according to special
- requirements, free rotation of hot air nozzles;
- Adjustable PCB jaw, to prevent collision with the components;
- Adjustable high-temperature resistance bracket, position rack designed to protect
- against hot;
- After BGA remove and welding have voice alarm function;
- Hand-held vacuum suction pen take BGA, convenient reliable and durable ;
Specifications
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PCB Size
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L330 W320mm
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PCB Thickness
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0.1~5mm
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Temperature Control
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K thermocouple PID Closed loop
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PCB Positioning mode
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Outer
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Bottom preheat
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Infrared 2400W
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Main (Top+bottom) heater
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Hot air 800W+800W
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Power supply
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Single phase 220V,50/60Hz,4.0KVA
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Dimension
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L550 W530 H550mm
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Weight
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Approx. 50kgs
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